• Features
    • AI Real-time Inspection: High-speed capture to achieve capture, inspection, and classification in the same time.
    • Automatic line width/aperture measurement.
  • Features

    • High-speed inspection + AI auto defect classification
    • Inspection items : Display area and Open/Short in peripheral Fan-Out area line, foreign material, contamination, scratch.
    • Supporting different sizes of Substrate or Panel according to customer needs.
  • Features

    • AI Real-time inspection.
    • Inspection items:Die defect, Damage, Contamination, Scratch, Die Missing.
    • Die shift/rotate after COW or COC.
    • Supporting 4"-8" wafers or different sizes of panels according to customer needs.
  • Features

    • AI Real-time Inspection:inspection operation speed can reach more than 50 FPS.
    • Inspection Items: Cu pad defect, Sfift, LED Bonding abnormal(Die Location Shift & Rotation).
    • Supporting different sizes of Substrate or Panel according to customer needs.

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